Power Electronic Packaging by Yong Liu

Author:Yong Liu
Language: eng
Format: epub
Publisher: Springer New York, New York, NY

Bonding temperature (degree)

S1 of ILD (MPa)

S3 of ILD (MPa)

190

146.9

225.6

205

156.5

224.1

220

166.6

221.5

Table 8.18Max stress of the ball–pad interface at 25°C

Bonding temperature (degree)

Sy of ball–pad interface (MPa)

Shear stress of ball–pad interface (MPa)

190

109.3

57.1

205

91.9

51.9

220

82.1

48.1

8.4.2.4 Effect of FAB Material Properties

The FAB material properties are defined as bilinear plastic material with an initial yield stress and three different tangent moduli. The results of different tangent modulus of FAB are shown in Tables 8.19 and 8.20 which are obtained with a FAB diameter of 2.8 mil and a bonding temperature of 205°C.Table 8.19Max stress on ILD layers with different FAB tangent moduli

Download

Copyright Disclaimer:
This site does not store any files on its server. We only index and link to content provided by other sites. Please contact the content providers to delete copyright contents if any and email us, we'll remove relevant links or contents immediately.